OCP Summit 2026: Powering AI with Open Innovations in Scale-Up, Scale-Out, and Scale-Across Networks

• At the 2026 Open Compute Project Global Summit, Meta is sharing the next generation of open networking infrastructure, including: 
  • Our first liquid-cooled network rack (IcePack), and 102.4T switch platform (IceCube).
  • Flattened Planar Fabric (FPF), a multiplane backend scale-out fabric that fundamentally changes how GPUs connect to the network
  • MetaRoCE, our open-source AI transport protocol.
  • Launching the Open Switch Platform Architecture (OSPA) initiative within OCP.
• We’re inviting engineers, silicon vendors, system integrators, and operators to join us and the OCP community in meeting the challenges of building open, efficient, and sustainable AI infrastructure.

At Meta, we believe that open networking is critical for building high-performance, scalable, and sustainable infrastructure, and we’ve acted on that conviction since co-founding the Open Compute Project (OCP) in 2011. 

Throughout the ongoing AI revolution, Meta has pushed the boundaries of what’s possible in data center networking and shared our advances with the industry. At OCP 2025, we introduced our latest AI scale-out fabrics and drove the creation of the Ethernet for Scale-Up Networking (ESUN) initiative.

This year at OCP 2026, we’re sharing the networking innovations that directly support our latest AI workloads such as Meta’s Muse Wonder and Muse Spark models, and Muse, our personal AI agent built for everyone. Here’s some of what’s new: